Green Policy
Sentelic Corporation is committed to environment, health and safety excellence and meeting or exceeding regulatory requirements with respect to the use of hazardous substances such as chlorinated organic compounds, brominates organic compounds (e.g. PBBs or PBDEs), organic tin compounds, asbestos, AZO compounds, formaldehyde, ozone depletion, residual monomers, benzene or poly vinyl chloride (except shipping tubes). and this policy has been effective starting from October.01.2005.
Lead free integrated circuits do not contain lead (Pb), cadmium (Cd), mercury (Hg),hexavalent chromium (Cr), Polybrominated Biphenyls (PBBs) or Polybrominated Biphenyl Ethers (PBDEs), and are therefore considered RoHS compliant. Some products (e.g. wafer level and flip chip packages) are assembled with high lead solders (>85% lead) and some are assembled with quartz crystals (piezoelectric devices) containing lead, but qualify for a RoHS exemption under Article 4, section 7 of the EU Directive 2002/95/EC.
Green Compliance
All of the Sentelic's products comply with the EU RoHS Directive 2002/95/EC and WEEE Directive 2002/960/EC for cadmium, hexavalent chromium, lead, mercury, polybrominated biphenyls (PBBs) and polybrominated biphenyl ethers (PBDEs).
Sentelic also compliesb with the definitions proposed by Sony SS00259, defines “Pb-free & Green” products, including: A lead (Pb) concentration that dose not exceed 0.1% of total weight, and products contain less than regulated concentrations of Cadmium (Cd), Mercury (Hg), Hexavalent Chromium, Polybrominated Biphenyis (PBB), and Polybrominated Biphenyl Ether (PBDE), and where none has been intentionally added as part of the manufacturing process
Halogen Free
Recent development call for the requirement that electronic components must not contain halogen . Sentelic observes and obeys the trend for halogen free products. Sentelic based on the definitions proposed the qualified proven result for this request SPEC. as table list & all the scan picture for the all the 3rd party report.
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